SCMS School of Engineering and Technology, Kochi, India
Topics
Wireless Ad hoc Networks Wireless Sensor Networks
Biography
Dr. Varun G Menon is currently Associate Professor in Department of Computer Science and Engineering, SCMS School of Engineering and Technology and Head of International Relations, SCMS Group of Educational Institutions, India. He has completed his PhD in Computer Science and Engineering and holds an M. Tech degree in Computer and Communication with University First Rank. He also holds an M.Sc in Applied Psychology, MBA in Human Resource Management and a Diploma in Training and Development (Dip. T. D.).
Dr. Varun G Menon is a member of Association for Computing Machinery (ACM) and has been actively involved in various activities of the organization. He is also a member of IEEE and International Association of Engineers. He is currently serving in the Editorial and Editorial Review Boards of 7 journals including the Journal of Organizational and End User Computing (Impact Factor 0.759), International Journal of E-Health and Medical Communications, International Journal of Disaster Response and Emergency Management. He is also the Editor for Taylor and Francis book on Wireless Networks. Dr. Varun G Menon received the Top Peer Reviewer Award by Publons in 2018 and his reviews have been rated as “Excellent” by editors of IEEE Transactions.
Dr. Varun G Menon is currently serving in the Review Boards of 32 High Impact Factor Journals including IEEE Transactions on Vehicular Technology, IEEE Communications Magazine, IEEE Access, IEEE Vehicular Technology Magazine, Ad Hoc Networks Journal - Elsevier, Computer Communications Journal - Elsevier, Vehicular Communications Journal – Elsevier, International Journal of Distributed Sensor Networks - Sage, International Journal of Communication Systems - Wiley, Ad Hoc & Sensor Wireless Networks Journal - Old City Publishing etc. He has published 30 research papers in peer reviewed and highly indexed International Journals and Conferences. He has also served in the Technical Program Committee and Organizing Committee of many pres
